Molex, 76145 1.9 mm Pitch Backplane Connector, Vertical, 16 Column, 18 Row, 288 Way
- RS 제품 번호:
- 694-254
- 제조사 부품 번호:
- 76145-5617
- 제조업체:
- Molex
대량 구매 할인 기용 가능
Subtotal (1 tray of 5 units)*
₩387,874.50
제조사가 재고 비축중
- 2026년 6월 22일 부터 배송 준비 완료
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수량 | 한팩당 | Per Tray* |
|---|---|---|
| 5 - 20 | ₩77,574.90 | ₩387,876.45 |
| 25 + | ₩76,022.70 | ₩380,115.45 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 694-254
- 제조사 부품 번호:
- 76145-5617
- 제조업체:
- Molex
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | Backplane Connector | |
| Current | 0.75A | |
| Number of Contacts | 288 | |
| Orientation | Vertical | |
| Number of Columns | 16 | |
| Number of Rows | 18 | |
| Voltage | 30V | |
| Housing Material | High Temperature Thermoplastic | |
| Pitch | 1.9mm | |
| Contact Material | High Performance Alloy | |
| Mount Type | Through Hole | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Press Fit | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | RoHS Compliant | |
| Series | 76145 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type Backplane Connector | ||
Current 0.75A | ||
Number of Contacts 288 | ||
Orientation Vertical | ||
Number of Columns 16 | ||
Number of Rows 18 | ||
Voltage 30V | ||
Housing Material High Temperature Thermoplastic | ||
Pitch 1.9mm | ||
Contact Material High Performance Alloy | ||
Mount Type Through Hole | ||
Contact Plating Gold | ||
Minimum Operating Temperature -55°C | ||
Termination Type Press Fit | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals RoHS Compliant | ||
Series 76145 | ||
- COO (Country of Origin):
- SG
The Molex Impact 100 Ohm 6 Pair Vertical Backplane Header is engineered for optimal connectivity in high-density applications. Designed with precision, this header features an open endwall and right-guided configuration that delivers exceptional performance at data rates of up to 25.0 Gbps. With a robust construction that supports up to 288 circuits using high-performance alloy metal and a Durable resin, it ensures a reliable connection under varying conditions. The installation is straightforward with through-hole compliant pin terminations, making it an Ideal choice for versatile PCB designs, while its Compact 16-column layout enhances space efficiency in electronic systems.
Supports a high data rate of 25.0 Gbps for fast data transmission
Vertical orientation optimises space and fits within Compact electronic assemblies
Designed for up to 288 circuits, accommodating substantial data needs
Lead-free components promote environmental compatibility and compliance
Durability rated for 200 mating cycles, ensuring long-lasting connections
Black resin housing provides additional protection and aesthetic value
Plating materials of gold and tin enhance corrosion resistance and other performance attributes
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