Molex, 170390 1.35 mm Pitch Connector Backplane Connector, Vertical Female, 10 Column, 12 Row, 120 Way

Subtotal (1 tray of 6 units)*

₩362,700.00

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  • 2026년 7월 06일 부터 배송 준비 완료
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Tray(s)
Per Tray
한팩당*
1 +₩362,700.00₩60,450.00

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
684-911
제조사 부품 번호:
170390-3000
제조업체:
Molex
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모두 선택

브랜드

Molex

Product Type

Backplane Connector

Backplane Connector Type

Connector

Number of Contacts

120

Current

0.75A

Number of Columns

10

Orientation

Vertical

Voltage

30V

Number of Rows

12

Connector Gender

Female

Pitch

1.35mm

Contact Plating

Gold over Tin

Termination Type

Solder

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

85°C

Contact Gender

Female

Standards/Approvals

REACH, RoHS

Series

170390

COO (Country of Origin):
SG
The Molex impact backplane connector and cable assembly system offers a sophisticated solution designed for high-performance applications. This 85 Ohm Plus mezzanine receptacle features a stack height of 18.00mm and is equipped for effective signal transmission with up to 120 circuits. Designed with lead-free compliance, this connector aligns with DU RoHS and REACH standards, ensuring minimal environmental impact. Its robust build includes a high-performance alloy metal construction and high-temperature thermoplastic resin, providing durability and reliability in challenging operational conditions. Ideal for vertical assembly, this product seamlessly mates with the 170335 Impact vertical header, making it a versatile choice for innovative electronic systems.

Impact 85 Ohm Plus design ensures optimal signal integrity

Lead free composition adheres to environmental compliance standards

Supports 120 circuits for expansive connection capabilities

Durable construction with high performance alloy for longevity

Meets high temperature thresholds thanks to specialized thermoplastic resin

Vertical orientation simplifies installation in various setups

Designed for consistent performance across 200 mating cycles

Compact design facilitates efficient circuit management in dense layouts

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