Molex, 170335 1.9 mm Pitch Connector Backplane Connector, Vertical, 12 Column, 12 Row, 144 Way
- RS 제품 번호:
- 684-011
- 제조사 부품 번호:
- 170335-1227
- 제조업체:
- Molex
Subtotal (1 tray of 8 units)*
₩347,348.80
일시적 품절
- 2026년 4월 01일 부터 배송
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Tray(s) | Per Tray | 한팩당* |
|---|---|---|
| 1 + | ₩347,348.80 | ₩43,418.60 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 684-011
- 제조사 부품 번호:
- 170335-1227
- 제조업체:
- Molex
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Backplane Connector Type | Connector | |
| Product Type | Backplane Connector | |
| Current | 0.75A | |
| Number of Contacts | 144 | |
| Number of Columns | 12 | |
| Orientation | Vertical | |
| Voltage | 30 V | |
| Number of Rows | 12 | |
| Pitch | 1.9mm | |
| Contact Plating | Gold over Tin | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | RoHS, REACH | |
| Series | 170335 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Backplane Connector Type Connector | ||
Product Type Backplane Connector | ||
Current 0.75A | ||
Number of Contacts 144 | ||
Number of Columns 12 | ||
Orientation Vertical | ||
Voltage 30 V | ||
Number of Rows 12 | ||
Pitch 1.9mm | ||
Contact Plating Gold over Tin | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals RoHS, REACH | ||
Series 170335 | ||
- COO (Country of Origin):
- SG
The Molex Impact 85 Ohm Plus 4 Pair Vertical Header designed to provide reliable connectivity in high-performance applications. With its dual end wall structure and 12 columns featuring 144 circuits, this PCB header excels in delivering precision connections in mezzanine and conventional applications. Enhanced durability is ensured with a mating cycle maximum of 200, allowing consistent performance in critical environments. This lead-free component operates within a temperature range of -55° to +85°C, making it suitable for a variety of industrial settings. Ideal for use in advanced electronics, it adheres to stringent environmental compliance standards, highlighting both its functionality and eco-friendliness.
Dual end wall design enhances stability and connectivity
Lead free materials contribute to environmental compliance
Finished with gold plating for optimal electrical conductivity
High temperature thermoplastic resin improves thermal resistance
Designed for through hole compliant pin termination for robustness
Suitable for high speed applications with a data rate of 25 Gbps
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