TE Connectivity, Z-PACK HM-Zd 2.5 mm Pitch High Speed Backplane Connector, Vertical Male, 10 Column, 4 Row, 40 Way
- RS 제품 번호:
- 679-475
- 제조사 부품 번호:
- 6469025-2
- 제조업체:
- TE Connectivity
N
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이 품목의 재입고 여부는 알 수 없으며 제조업체에서 단종되고 있습니다.
- RS 제품 번호:
- 679-475
- 제조사 부품 번호:
- 6469025-2
- 제조업체:
- TE Connectivity
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제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Backplane Connector Type | High Speed | |
| Product Type | Backplane Connector | |
| Current | 0.7A | |
| Number of Contacts | 40 | |
| Orientation | Vertical | |
| Number of Columns | 10 | |
| Connector Gender | Male | |
| Voltage | 250V | |
| Number of Rows | 4 | |
| Housing Material | Fibreglass Polyester | |
| Pitch | 2.5mm | |
| Mount Type | Board | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -65°C | |
| Termination Type | Press Fit | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Standards/Approvals | UL 94V-0 | |
| Series | Z-PACK HM-Zd | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Backplane Connector Type High Speed | ||
Product Type Backplane Connector | ||
Current 0.7A | ||
Number of Contacts 40 | ||
Orientation Vertical | ||
Number of Columns 10 | ||
Connector Gender Male | ||
Voltage 250V | ||
Number of Rows 4 | ||
Housing Material Fibreglass Polyester | ||
Pitch 2.5mm | ||
Mount Type Board | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Minimum Operating Temperature -65°C | ||
Termination Type Press Fit | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Standards/Approvals UL 94V-0 | ||
Series Z-PACK HM-Zd | ||
- COO (Country of Origin):
- CN
The TE Connectivity 40 Position High Speed Backplane Connector is a vertical PCB mount header designed for high-speed data transmission in modular systems. It features a 4-row, 10-column layout with partially shrouded housing for enhanced mating alignment and mechanical protection. This connector is part of the Z-PACK HM-Zd series, optimized for backplane architectures requiring Compact and reliable signal routing.
Vertical PCB mount header configuration for efficient board stacking
Partially shrouded housing with guide lugs for secure mating alignment
2.5 mm pitch supports high-speed signal transmission up to 1 Gb/s
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