Bergquist TGP 2000 Series Self-Adhesive Thermal Gap Pad, 0.06in Thick, 2W/m·K, Silicone, 8 x 16 x 0.06in
- RS 제품 번호:
- 282-6746
- 제조사 부품 번호:
- GAP PAD TGP 2000, 8in x 16in x 0.06
- 제조업체:
- Bergquist
일시 품절-다음 입고 날짜는 24/07/2024 (일/월/년) 이며, 그 후 5-10영업일내 홍콩에서 발송. 정확한 입고 수량에 대한 문의는 krenquiry@rs-components.com 로 연락주세요.
단가 개당
₩200,978.448
수량 | 한팩당 |
1 + | ₩200,978.448 |
- RS 제품 번호:
- 282-6746
- 제조사 부품 번호:
- GAP PAD TGP 2000, 8in x 16in x 0.06
- 제조업체:
- Bergquist
제정법과 컴플라이언스
해당 안됨
- COO (Country of Origin):
- US
제품 세부 사항
The Bergquist Highly Conformable, Thermally Conductive, Reinforced S-Class Gap Filling Material. It is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.
Highly Conformable
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance
사양
속성 | 값 |
---|---|
Dimensions | 8 x 16 x 0.06in |
Thickness | 0.06in |
Length | 8in |
Width | 16in |
Thermal Conductivity | 2W/m·K |
Material | Silicone |
Self-Adhesive | Yes |
Series | TGP 2000 |