VPG Foil Resistors VSMP 350 Ω, 0805 Metal Foil Surface Mount Resistor ±0.01 % 0.2 W - Y1624350R000T9R
- RS 제품 번호:
- 173-2910
- 제조사 부품 번호:
- Y1624350R000T9R
- 제조업체:
- VPG Foil Resistors
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- RS 제품 번호:
- 173-2910
- 제조사 부품 번호:
- Y1624350R000T9R
- 제조업체:
- VPG Foil Resistors
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | VPG Foil Resistors | |
| Product Type | Surface Mount Resistor | |
| Resistance | 350Ω | |
| Technology | Metal Foil | |
| Resistor Type | Precision | |
| Package/Case | 0805 | |
| Tolerance | ±0.01 % | |
| Packaging | Tape & Reel | |
| Voltage | 40 V | |
| Power Rating | 0.2W | |
| Temperature Coefficient | -0.2 ppm/°C, +0.2 ppm/°C | |
| Automotive Standard | No | |
| Series | VSMP | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 125°C | |
| Termination Style | Solder | |
| Width | 1.27 mm | |
| Length | 2.03mm | |
| Height | 0.64mm | |
| Standards/Approvals | RoHS | |
| 모두 선택 | ||
|---|---|---|
브랜드 VPG Foil Resistors | ||
Product Type Surface Mount Resistor | ||
Resistance 350Ω | ||
Technology Metal Foil | ||
Resistor Type Precision | ||
Package/Case 0805 | ||
Tolerance ±0.01 % | ||
Packaging Tape & Reel | ||
Voltage 40 V | ||
Power Rating 0.2W | ||
Temperature Coefficient -0.2 ppm/°C, +0.2 ppm/°C | ||
Automotive Standard No | ||
Series VSMP | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 125°C | ||
Termination Style Solder | ||
Width 1.27 mm | ||
Length 2.03mm | ||
Height 0.64mm | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- GB
VSMP Series Ultra High Precision Z Foil Wraparound SMD Chip Resistors
VSMP Series ultra high precision Z Foil surface mount chip resistors offering proven reliability and excellent stability under different environmental conditions. The VSMP’s full wraparound terminations ensure safe handling during the manufacturing process and provides stability during multiple thermal cycles. Applications for the VSMP resistor include; Automatic test equipment (ATE); high precision instrumentation; laboratory, industrial and medical; Audio; EB applications; Military and Space; Airborne; Down-hole instrumentation; Communication
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