Microchip 150 V 125 A Diode 2-Pin B MELF 1N5811US
- RS 제품 번호:
- 333-163
- 제조사 부품 번호:
- 1N5811US
- 제조업체:
- Microchip
Subtotal (1 Box of 41 units)*
₩768,795.92
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- 2026년 11월 03일 부터 배송
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수량 | 한팩당 | Per Box* |
|---|---|---|
| 41 + | ₩18,751.12 | ₩768,773.36 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 333-163
- 제조사 부품 번호:
- 1N5811US
- 제조업체:
- Microchip
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Microchip | |
| Product Type | Diode | |
| Mount Type | Surface | |
| Package Type | B MELF | |
| Maximum Continuous Forward Current If | 125A | |
| Peak Reverse Repetitive Voltage Vrrm | 150V | |
| Series | 1N5811 | |
| Diode Configuration | Single | |
| Pin Count | 2 | |
| Minimum Operating Temperature | -65°C | |
| Maximum Operating Temperature | 175°C | |
| Peak Reverse Recovery Time trr | 30ns | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Microchip | ||
Product Type Diode | ||
Mount Type Surface | ||
Package Type B MELF | ||
Maximum Continuous Forward Current If 125A | ||
Peak Reverse Repetitive Voltage Vrrm 150V | ||
Series 1N5811 | ||
Diode Configuration Single | ||
Pin Count 2 | ||
Minimum Operating Temperature -65°C | ||
Maximum Operating Temperature 175°C | ||
Peak Reverse Recovery Time trr 30ns | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
The Microchip Ultrafast Recovery rectifier diode series is military qualified and is ideal for high reliability applications where a failure cannot be tolerated. The industry recognized 6.0 amp rated rectifiers with working peak reverse voltages from 50 to 150 volts are hermetically sealed with void less glass construction using an internal Category 1 metallurgical bond. These devices are available in both surface mount MELF and leaded package configurations. Microchip also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time requirements including standard, fast and ultrafast device types in both through hole and surface mount packages.
Void less hermetically sealed glass package
Quadruple layer passivation
Extremely robust construction
Void less hermetically sealed glass package
Quadruple layer passivation
Extremely robust construction
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