RS PRO Transparent Gel Potting Compound 1000 g

A two component, low viscosity silicone encapsulant specially designed to protect the electrical characteristics of electronic circuits.

Transparent product cures in place to form a cushioning self-healing gel like mass
The cured gel retains the stress relief and self-healing qualities of a liquid
Physical and electrical stability over a wide temperature range
Permanent pressure sensitive adhesion to most materials without use of a primer
Resistant to reversion, provides thermal/mechanical shock and vibration dampening
It is suited for applications requiring long term sealing against moisture and other atmospheric contaminants
Dielectric strength: 23 kV/mm

Dielectric gels are a specialist type of encapsulant or electronic potting compound used for the encapsulation of PCBs (Printed Circuit Boards) and electronics components. Potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The potting compound once applied and cured, encases your electronics in a solid mass providing a protective barrier. This gel can also be applied in thick layers to encapsulate a component. The barrier provided by this silicone potting compound protects and insulates the components from damaging environments including moisture, vibration and general contamination allowing them to maintain a high performance.

• Features and Benefits
• Excellent flexibility and dimensional stability
• Self-heals when torn
• Low stress on electrical components
• Protects against thermal and mechanical shock and dampens vibration
• Good resistance to moisture and contaminants
• Provides physical and electrical stability over a wide temperature range
• Adheres to most surfaces without a primer

This silicone compound, with its soft and flexible consistency, is ideal for use with delicate electronic PCB components. Applications include:

• LED and Lighting
• Automotive
• Electronics

Before applying this silicone potting compound it is important that any residue or contaminants are removed from the electronic components prior to potting. The electronic assembly is placed inside a mould called ’The pot’. This mould is then filled with the mixed potting compound that hardens and permanently protects the assembly. Circuit boards can also be potted and are often called ’potted’ PCBs. These circuit boards have high walled sides forming an enclosure with the mounted electronic components sitting inside. The potting compound is then poured into this enclosure. This silicone gel compound can also be applied in thick layers as a coating around the components.

Potting Compounds: Silicone Compounds

These compounds have a temperature range of –40°C to +180°C