Samtec SEAF Series Straight Surface PCB Socket, 160-Contact, 8 Row, 1.27 mm Pitch Solder
- RS 제품 번호:
- 767-8956
- 제조사 부품 번호:
- SEAF-20-05.0-S-08-2-A-K-TR
- 제조업체:
- Samtec
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Subtotal (1 unit)*
₩36,725.80
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- 1 개 단위 배송 준비 완료
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수량 | 한팩당 |
|---|---|
| 1 + | ₩36,725.80 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 767-8956
- 제조사 부품 번호:
- SEAF-20-05.0-S-08-2-A-K-TR
- 제조업체:
- Samtec
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Samtec | |
| Number of Contacts | 160 | |
| Product Type | PCB Socket | |
| Sub Type | Board-to-Board | |
| Number of Rows | 8 | |
| Pitch | 1.27mm | |
| Current | 2.3A | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Stacking Height | 18.5mm | |
| Voltage | 240 V | |
| Series | SEAF | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 2.5mm | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Female | |
| Contact Material | Copper | |
| Contact Plating | Gold | |
| Standards/Approvals | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Samtec | ||
Number of Contacts 160 | ||
Product Type PCB Socket | ||
Sub Type Board-to-Board | ||
Number of Rows 8 | ||
Pitch 1.27mm | ||
Current 2.3A | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Stacking Height 18.5mm | ||
Voltage 240 V | ||
Series SEAF | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 2.5mm | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Female | ||
Contact Material Copper | ||
Contact Plating Gold | ||
Standards/Approvals No | ||
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area