Samtec ADF6 Series Vertical Surface PCB Socket, 20-Contact, 4 Row, 0.635 mm Pitch Solder
- RS 제품 번호:
- 202-7887
- 제조사 부품 번호:
- ADF6-20-03.5-L-4-2-A
- 제조업체:
- Samtec
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대량 구매 할인 기용 가능
Subtotal (1 unit)*
₩35,988.84
현재 액세스할 수 없는 재고 정보 - 나중에 다시 확인해 주세요.
수량 | 한팩당 |
|---|---|
| 1 - 24 | ₩35,988.84 |
| 25 - 49 | ₩35,197.36 |
| 50 + | ₩34,443.48 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 202-7887
- 제조사 부품 번호:
- ADF6-20-03.5-L-4-2-A
- 제조업체:
- Samtec
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 20 | |
| Number of Rows | 4 | |
| Sub Type | High Density Socket | |
| Pitch | 0.635mm | |
| Current | 1.34A | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Stacking Height | 5mm | |
| Connector System | Board-to-Board | |
| Voltage | 219 V | |
| Series | ADF6 | |
| Row Pitch | 0.96mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Material | Copper Alloy | |
| Contact Plating | Tin over Nickel, Gold | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | EU RoHS, EU REACH, CHINA RoHS | |
| 모두 선택 | ||
|---|---|---|
브랜드 Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 20 | ||
Number of Rows 4 | ||
Sub Type High Density Socket | ||
Pitch 0.635mm | ||
Current 1.34A | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Vertical | ||
Stacking Height 5mm | ||
Connector System Board-to-Board | ||
Voltage 219 V | ||
Series ADF6 | ||
Row Pitch 0.96mm | ||
Minimum Operating Temperature -55°C | ||
Contact Material Copper Alloy | ||
Contact Plating Tin over Nickel, Gold | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals EU RoHS, EU REACH, CHINA RoHS | ||
- COO (Country of Origin):
- US
The Samtec Connector is a low profile, ultra-slim surface mount socket. Edge Rate® contact system optimized for signal integrity performance. Supports 56 Gbps PAM4 (28 Gbps NRZ) applications.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development