Amphenol Communications Solutions BergStak Series Straight Surface PCB Socket, 80-Contact, 2 Row, 0.8 mm Pitch Solder
- RS 제품 번호:
- 182-2974
- 제조사 부품 번호:
- 61082-081402LF
- 제조업체:
- Amphenol Communications Solutions
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- RS 제품 번호:
- 182-2974
- 제조사 부품 번호:
- 61082-081402LF
- 제조업체:
- Amphenol Communications Solutions
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참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Amphenol Communications Solutions | |
| Product Type | PCB Socket | |
| Number of Contacts | 80 | |
| Sub Type | Receptacle | |
| Number of Rows | 2 | |
| Current | 800mA | |
| Pitch | 0.8mm | |
| Termination Type | Solder | |
| Housing Material | Glass Filled Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Stacking Height | 20mm | |
| Voltage | 100V | |
| Series | BergStak | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Female | |
| Contact Material | Copper Alloy | |
| Maximum Operating Temperature | 125°C | |
| Contact Plating | Gold | |
| Standards/Approvals | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Amphenol Communications Solutions | ||
Product Type PCB Socket | ||
Number of Contacts 80 | ||
Sub Type Receptacle | ||
Number of Rows 2 | ||
Current 800mA | ||
Pitch 0.8mm | ||
Termination Type Solder | ||
Housing Material Glass Filled Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Stacking Height 20mm | ||
Voltage 100V | ||
Series BergStak | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Female | ||
Contact Material Copper Alloy | ||
Maximum Operating Temperature 125°C | ||
Contact Plating Gold | ||
Standards/Approvals No | ||
- COO (Country of Origin):
- CN
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
0.8 mm double-row contact pitch conserves printed circuit board space
Scoop-proof feature housings
Multiple plating options available
Multiple packaging options available
PCB locator pegs option
Lead-free
Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights
Suitable for parallel board stacking applications
Comprehensive range of sizes and stack heights to satisfy all needs
High density for all electrical applications needs
Prevents reverse mating
Satisfies different application requirement
Suitable for varies feeding processing
Facilitates ease and accuracy during manual assembly
BergStak® 0.80 mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.