제조사부품번호

Samtec SEAF Series Straight Surface PCB Socket, 320-Contact, 8 Row, 1.27 mm Pitch Solder

RS 제품 번호:: 180-2617
제조사 부품 번호:: SEAF-40-05.0-S-08-2-A-K-TR
제조업체:: Samtec

Samtec SEAF Series Straight Surface PCB Socket, 320-Contact, 8 Row, 1.27 mm Pitch Solder

대량 구매 할인 기용 가능

Subtotal (1 unit)*

₩58,229.24

재고있음

추가로 2026년 3월 23일 부터 2 개 단위 배송

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수량	한팩당
1 - 56	₩58,229.24
57 - 112	₩56,948.96
113 +	₩55,726.96

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:: 180-2617
제조사 부품 번호:: SEAF-40-05.0-S-08-2-A-K-TR
제조업체:: Samtec

참조 문서

제정법과 컴플라이언스

제품 세부 사항

제품 정보를 선택해 유사 제품을 찾기

모두 선택	제품 정보	값
	브랜드	Samtec
	Number of Contacts	320
	Product Type	PCB Socket
	Sub Type	High Speed High Density Open-Pin-Field Array Socket
	Number of Rows	8
	Current	2.7A
	Pitch	1.27mm
	Housing Material	Liquid Crystal Polymer
	Termination Type	Solder
	Mount Type	Surface
	Orientation	Straight
	Stacking Height	18.5mm
	Connector System	Board-to-Board
	Voltage	240 V
	Series	SEAF
	Row Pitch	2.5mm
	Minimum Operating Temperature	-55°C
	Contact Gender	Female
	Contact Material	Copper
	Contact Plating	Gold
	Maximum Operating Temperature	125°C
	Standards/Approvals	No

	모두 선택
	브랜드 Samtec
	Number of Contacts 320
	Product Type PCB Socket
	Sub Type High Speed High Density Open-Pin-Field Array Socket
	Number of Rows 8
	Current 2.7A
	Pitch 1.27mm
	Housing Material Liquid Crystal Polymer
	Termination Type Solder
	Mount Type Surface
	Orientation Straight
	Stacking Height 18.5mm
	Connector System Board-to-Board
	Voltage 240 V
	Series SEAF
	Row Pitch 2.5mm
	Minimum Operating Temperature -55°C
	Contact Gender Female
	Contact Material Copper
	Contact Plating Gold
	Maximum Operating Temperature 125°C
	Standards/Approvals No

Datasheet

This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.

Up to 500 I/Os

.050" (1.27 mm) pitch

Rugged Edge Rate® contact

Lower insertion/withdrawal forces

Solder charge termination

7 mm - 17.5 mm stack heights

Dual sourced by Molex®

Samtec 28+ Gbps Solution