Molex 46557 Series Vertical Surface Mount PCB Socket, 80-Contact, 4 Row, 1.27 mm Pitch Surface Mount
- RS 제품 번호:
- 693-744
- 제조사 부품 번호:
- 46557-2545
- 제조업체:
- Molex
Subtotal (1 reel of 210 units)*
₩8,862,960.00
현재 액세스할 수 없는 재고 정보 - 나중에 다시 확인해 주세요.
릴당 | 릴당 | 한팩당* |
|---|---|---|
| 1 + | ₩8,862,960.00 | ₩42,204.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 693-744
- 제조사 부품 번호:
- 46557-2545
- 제조업체:
- Molex
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | PCB Socket | |
| Number of Contacts | 80 | |
| Number of Rows | 4 | |
| Sub Type | Socket | |
| Current | 2.7A | |
| Pitch | 1.27mm | |
| Housing Material | High Temperature Thermoplastic | |
| Termination Type | Surface Mount | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Stacking Height | 8mm | |
| Voltage | 240V | |
| Series | 46557 | |
| Row Pitch | 1.27mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Plating | Gold | |
| Maximum Operating Temperature | 125°C | |
| Contact Material | Copper Alloy | |
| Standards/Approvals | UL E29179 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type PCB Socket | ||
Number of Contacts 80 | ||
Number of Rows 4 | ||
Sub Type Socket | ||
Current 2.7A | ||
Pitch 1.27mm | ||
Housing Material High Temperature Thermoplastic | ||
Termination Type Surface Mount | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Stacking Height 8mm | ||
Voltage 240V | ||
Series 46557 | ||
Row Pitch 1.27mm | ||
Minimum Operating Temperature -55°C | ||
Contact Plating Gold | ||
Maximum Operating Temperature 125°C | ||
Contact Material Copper Alloy | ||
Standards/Approvals UL E29179 | ||
- COO (Country of Origin):
- US
The Molex SEARAY Slim Receptacle is engineered for seamless board-to-board connectivity, boasting an innovative design tailored for high-performance applications. Featuring 80 circuits within a Compact 8.00mm unmated height and structured in four rows, this receptacle is Ideal for mezzanine and signal applications. Its lead-free solder charging ensures compliance with contemporary environmental standards, while the copper alloy construction with a gold-plated mating surface delivers reliable electrical performance. Designed with precision, it facilitates easy robotic placement and offers robustness in various operational conditions, making it a perfect choice for modern electronic assemblies.
80 circuits ensure ample connectivity options
8.00mm unmated height contributes to space-saving designs
Four-row configuration enhances signal integrity
Lead-free design aligns with environmental compliance requirements
Durable copper alloy construction offers long-lasting performance
Gold-plated mating surface reduces contact resistance
Designed for board-to-board and mezzanine applications, increasing versatility
Robotic placement compatibility simplifies assembly processes
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