Samtec SEAM Series Straight Surface PCB Header, 400 Contact(s), 1.27 mm Pitch, 10 Row, Shrouded
- RS 제품 번호:
- 767-9044P
- 제조사 부품 번호:
- SEAM-40-03.5-S-10-2-A-K-TR
- 제조업체:
- Samtec
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대량 구매 할인 기용 가능
Subtotal 5 units (supplied in a bag)*
₩363,977.40
재고있음
- 3 개 단위 배송 준비 완료
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수량 | 한팩당 |
|---|---|
| 5 + | ₩72,795.48 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 767-9044P
- 제조사 부품 번호:
- SEAM-40-03.5-S-10-2-A-K-TR
- 제조업체:
- Samtec
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Samtec | |
| Product Type | PCB Header | |
| Series | SEAM | |
| Pitch | 1.27mm | |
| Current | 1.8A | |
| Number of Contacts | 400 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 10 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Surface | |
| Contact Plating | Gold | |
| Contact Material | Copper Alloy | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1.27mm | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Voltage | 240 V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Samtec | ||
Product Type PCB Header | ||
Series SEAM | ||
Pitch 1.27mm | ||
Current 1.8A | ||
Number of Contacts 400 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 10 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board-to-Board | ||
Mount Type Surface | ||
Contact Plating Gold | ||
Contact Material Copper Alloy | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1.27mm | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
Voltage 240 V | ||
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area