Molex Micro-Fit 3.0 Series Straight Surface PCB Header, 10 Contact(s), 3 mm Pitch, 2 Row, Shrouded

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Subtotal (1 pack of 5 units)*

₩22,804.40

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한팩당
한팩당*
5 - 95₩4,560.88₩22,804.40
100 - 370₩4,425.52₩22,127.60
375 - 1495₩4,282.64₩21,413.20
1500 - 2995₩4,192.40₩20,962.00
3000 +₩4,120.96₩20,604.80

* 참고 가격: 실제 구매가격과 다를 수 있습니다

포장 옵션
RS 제품 번호:
670-1995
제조사 부품 번호:
43045-1018
제조업체:
Molex
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모두 선택

브랜드

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Current

5A

Pitch

3mm

Housing Material

High Temperature Thermoplastic

Number of Contacts

10

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Connector System

Wire-to-Board

Contact Material

Brass

Contact Plating

Tin

Minimum Operating Temperature

-40°C

Row Pitch

3mm

Termination Type

Solder

Maximum Operating Temperature

125°C

Contact Gender

Male

Mating Pin Length

3mm

Standards/Approvals

No

Voltage

250 V

Distrelec Product Id

304-33-538

Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series


Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Solder tabs for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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