Molex 76015 Series Vertical PCB Backplane Connector, 140 Contact(s), 3.7 mm Pitch, 7 Row, Unshrouded
- RS 제품 번호:
- 691-344
- 제조사 부품 번호:
- 76015-1102
- 제조업체:
- Molex
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- RS 제품 번호:
- 691-344
- 제조사 부품 번호:
- 76015-1102
- 제조업체:
- Molex
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Series | 76015 | |
| Product Type | Backplane Connector | |
| Current | 1A | |
| Pitch | 3.7mm | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Contacts | 140 | |
| Number of Rows | 7 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Header | |
| Mount Type | PCB | |
| Contact Plating | Gold | |
| Contact Material | High Performance Alloy | |
| Row Pitch | 3.7mm | |
| Termination Type | Through Hole | |
| Tail Pin Length | 2.1mm | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | UL E29179 | |
| Mating Pin Length | 3.9mm | |
| Voltage | 120V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Series 76015 | ||
Product Type Backplane Connector | ||
Current 1A | ||
Pitch 3.7mm | ||
Housing Material High Temperature Thermoplastic | ||
Number of Contacts 140 | ||
Number of Rows 7 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Header | ||
Mount Type PCB | ||
Contact Plating Gold | ||
Contact Material High Performance Alloy | ||
Row Pitch 3.7mm | ||
Termination Type Through Hole | ||
Tail Pin Length 2.1mm | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals UL E29179 | ||
Mating Pin Length 3.9mm | ||
Voltage 120V | ||
- COO (Country of Origin):
- MY
The Molex GbX I-Trac Vertical Header Module is expertly designed to facilitate sophisticated backplane and midplane connections. This module features a 1.85mm by 3.70mm pitch, unmediated open ends, and supports up to 140 circuits across 7 rows and 10 columns. Crafted for reliability in high-performance environments, it offers exceptional durability and a mating pin length of 3.90mm. This Active component is essential for applications requiring efficient and secure interconnectivity, making it a VITAL choice for contemporary electronic systems. Its compatibility with vertical receptacles and guide pins further enhances its utility in Advanced PCB designs, ensuring robust functionality and structural integrity.
Supports a maximum data rate of 12.0 Gbps for high-speed applications
Designed with 200 mating cycles for enhanced durability
Constructed from high-performance alloy and high-temperature thermoplastic for resilience
Black resin colour integrates easily into various design aesthetics
Features a vertical orientation that optimises space efficiency on PCBs
Utilises a lead-free solder process for environmentally conscious manufacturing
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