Samtec UDM6 Series Vertical Through Hole PCB Header, 240 Contact(s), 0.635 mm Pitch, 1 Row, Shrouded
- RS 제품 번호:
- 644-468
- 제조사 부품 번호:
- UDM6-10-2-01.5-L-A-TH-TR
- 제조업체:
- Samtec
대량 구매 할인 기용 가능
Subtotal (1 unit)*
₩26,718.56
재고있음
- 116 개 단위 배송 준비 완료
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수량 | 한팩당 |
|---|---|
| 1 - 9 | ₩26,718.56 |
| 10 + | ₩24,573.48 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 644-468
- 제조사 부품 번호:
- UDM6-10-2-01.5-L-A-TH-TR
- 제조업체:
- Samtec
사양
참조 문서
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Samtec | |
| Product Type | PCB Header | |
| Series | UDM6 | |
| Pitch | 0.635mm | |
| Current | 15A | |
| Number of Contacts | 240 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold, Tin | |
| Termination Type | Solder | |
| Row Pitch | 0.635mm | |
| Minimum Operating Temperature | -55°C | |
| Tail Pin Length | 1.5mm | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG | |
| Voltage | 283 V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Samtec | ||
Product Type PCB Header | ||
Series UDM6 | ||
Pitch 0.635mm | ||
Current 15A | ||
Number of Contacts 240 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Contact Material Copper Alloy | ||
Contact Plating Gold, Tin | ||
Termination Type Solder | ||
Row Pitch 0.635mm | ||
Minimum Operating Temperature -55°C | ||
Tail Pin Length 1.5mm | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG | ||
Voltage 283 V | ||
The Samtec 0.635 mm Socket is a AcceleRate mP high-density, high-speed power/signal socket which delivers industry leading performance with a compact 5 mm profile with 10 mm and 16 mm stack heights in development. It supports up to 8 power blades and 240 signal positions with higher counts coming soon, utilizes rotated power blades for enhanced cooling and simplified breakout routing, and features an open-pin-field design for routing and grounding flexibility. Engineered for high-speed applications, it delivers 64 Gbps PAM4 and is PCIe 6.0/CXL 3.1 capable, with alignment pins, polarized guide posts, and weld tabs included for secure mating and board retention.
Best in class density for power and signal
Rotated power blades improve performance and simplify breakout region
Open-pin-field design for routing and grounding flexibility
Polarized guide posts for blind mating
Optional alignment pins