Samtec UDF6 Series Vertical Through Hole PCB Header, 240 Contact(s), 0.635 mm Pitch, 2 Row, Shrouded

대량 구매 할인 기용 가능

Subtotal (1 unit)*

₩48,748.40

Add to Basket
수량 선택 또는 입력
현재 액세스할 수 없는 재고 정보 - 나중에 다시 확인해 주세요.
수량
한팩당
1 - 9₩48,748.40
10 +₩44,839.88

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
644-467
제조사 부품 번호:
UDF6-40-4-03.5-L-A-TH-TR
제조업체:
Samtec
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Samtec

Product Type

PCB Header

Series

UDF6

Pitch

0.635mm

Current

15A

Housing Material

Liquid Crystal Polymer

Number of Contacts

240

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Plating

Gold, Tin

Contact Material

Copper Alloy

Minimum Operating Temperature

-55°C

Row Pitch

0.635mm

Termination Type

Solder

Maximum Operating Temperature

125°C

Tail Pin Length

3.5mm

Standards/Approvals

PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG

Voltage

283 V

The Samtec High-Density and High-Speed Power/Signal Socket is an industry-leading board connector delivering best-in-class density and performance with rotated power blades for enhanced cooling, current capacity, and simplified breakout routing. Featuring an open-pin-field design, it supports up to 8 power blades and 240 signal contacts and offers a low profile 5 mm stack height. Engineered for demanding applications, it supports data rates up to 64 Gbps PAM4 and includes optional alignment/weld tabs and polarized posts for robust mating integrity.

PCIe 6.0/CXL 3.1 capable

Weld tabs included for a secure connection to the board

Polarized guide posts for blind mating

Optional alignment pins

0.635 mm signal pitch