Molex 21657 Series Vertical Through Hole PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row, Shrouded

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Subtotal (1 pack of 5 units)*

₩17,604.60

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  • 추가로 2026년 5월 11일 부터 33 개 단위 배송
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한팩당
한팩당*
1 - 4₩17,604.60₩3,521.70
5 - 9₩16,194.75₩3,238.95
10 +₩14,609.40₩2,921.10

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
536-872
제조사 부품 번호:
2165711043
제조업체:
Molex
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Molex

Series

21657

Product Type

PCB Header

Pitch

3mm

Current

13A

Number of Contacts

3

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Power, Wire-to-Board

Contact Plating

Matt Tin

Contact Material

High Copper Alloy

Row Pitch

3mm

Minimum Operating Temperature

-40°C

Termination Type

Solder

Maximum Operating Temperature

125°C

Tail Pin Length

3.18mm

Contact Gender

Female

Standards/Approvals

No

Voltage

600Vrms

COO (Country of Origin):
CN
The Molex Micro fit+ versa Color vertical header is the ideal solution for high density connectivity in power and wire to board applications. Designed with a robust 3.00mm pitch, this through hole component offers a reliable single row and three circuits, ensuring efficient performance in a compact footprint. Its matte tin plating not only provides optimal conductivity but also offers excellent resistance to corrosion, making it suitable for various environments. Additionally, the glow wire capability enhances safety by reducing risks associated with overheating. The thoughtful design features, such as keying and locking mechanisms, facilitate secure connections that meet the demanding requirements of modern electronic devices, ensuring peace of mind for engineers and designers alike.

Low halogen construction ensures compliance with environmental standards

Durable liquid crystal polymer resin provides enhanced thermal stability

Vertical orientation optimises space in compact assemblies

Meets stringent safety certifications from CSA and UL

PCB retention features facilitate secure mounting during assembly

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