Phoenix Contact MCDNV Series Vertical Wave Soldering Mount PCB Header, 6 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

Subtotal (1 pack of 95 units)*

₩453,711.68

Add to Basket
수량 선택 또는 입력
일시적 품절
  • 2026년 3월 11일 부터 배송
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
한팩당
한팩당*
1 +₩453,711.68₩4,775.20

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
488-993
제조사 부품 번호:
1952791
제조업체:
Phoenix Contact
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Phoenix Contact

Product Type

PCB Header

Series

MCDNV

Current

8A

Pitch

3.5mm

Number of Contacts

6

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Wave Soldering Mount

Connector System

COMBICON FMC 1

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Row Pitch

3.5mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

100°C

Tail Pin Length

2.6mm

Contact Gender

Male

Standards/Approvals

cULus Recognised, VDE

Mating Pin Length

2.6mm

Voltage

160 V

COO (Country of Origin):
DE
The Phoenix Contact PCB header from the MCDNV 1.5/-G1-THR series is designed for optimal integration into modern electronic assemblies. With a pitch of 3.5 mm and a robust construction, it supports a nominal current of 8 A, ensuring reliable performance across various applications. The vertical connection design facilitates multi-row arrangements on PCBs, maximising space efficiency while maintaining a high degree of freedom for device design. Featuring a black housing, this component is constructed from durable materials, making it suitable for both THR soldering and wave soldering processes. Ideal for connectors utilising diverse connection technologies, it allows for increased contact density through its conductor connection on multiple levels. This product perfectly blends versatility and reliability, making it an excellent choice for engineers and manufacturers alike.

Designed for seamless integration into SMT soldering processes

Facilitates multi-row arrangements to optimise PCB layout

Compatible with various connection technologies for versatile applications

Enables higher contact density with conductors operating across several levels

Constructed from reliable materials that comply with RoHS standards

Ideal for both reflow and wave soldering applications

Features a pin layout that supports linear pinning for enhanced stability

Packed in cardboard for eco-friendly and secure delivery

Accompanied by comprehensive user information and design guidelines

관련된 링크들