Infineon 650V CoolMOS SiC N-Channel MOSFET, 136 A, 650 V, 22-Pin PG-HDSOP-22 IPDQ65R017CFD7XTMA1
- RS 제품 번호:
- 284-868
- 제조사 부품 번호:
- IPDQ65R017CFD7XTMA1
- 제조업체:
- Infineon
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RS는 더 이상 이 제품을 입고하지 않습니다.
- RS 제품 번호:
- 284-868
- 제조사 부품 번호:
- IPDQ65R017CFD7XTMA1
- 제조업체:
- Infineon
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Infineon | |
| Channel Type | N | |
| Maximum Continuous Drain Current | 136 A | |
| Maximum Drain Source Voltage | 650 V | |
| Package Type | PG-HDSOP-22 | |
| Series | 650V CoolMOS | |
| Mounting Type | Surface Mount | |
| Pin Count | 22 | |
| Channel Mode | Enhancement | |
| Transistor Material | SiC | |
| Number of Elements per Chip | 1 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Infineon | ||
Channel Type N | ||
Maximum Continuous Drain Current 136 A | ||
Maximum Drain Source Voltage 650 V | ||
Package Type PG-HDSOP-22 | ||
Series 650V CoolMOS | ||
Mounting Type Surface Mount | ||
Pin Count 22 | ||
Channel Mode Enhancement | ||
Transistor Material SiC | ||
Number of Elements per Chip 1 | ||
The Infineon MOSFET features a CoolMOS CFD7 series which is engineered for high efficiency in resonant switching applications. With a breakdown voltage of 650V, the product excels in thermal performance, making it an ideal choice for demanding environments such as server and telecom systems, EV charging, and solar applications. Its superior hard commutation capabilities and rapid switching attributes provide reliability and safety in critical applications. The device aims to enhance power density while ensuring exceptional performance in light load conditions. As such, it serves as a potent solution for contemporary energy efficient designs.
Ultra fast body diode boosts switching performance
Optimised for phase shift full bridge applications
High thermal robustness enhances overall efficiency
Flexible design with low RDS temperature dependency
Supports higher bus voltages for increased power density
Resilient against hard commutation for reliable operation
Fully qualified per JEDEC standards
Optimised for phase shift full bridge applications
High thermal robustness enhances overall efficiency
Flexible design with low RDS temperature dependency
Supports higher bus voltages for increased power density
Resilient against hard commutation for reliable operation
Fully qualified per JEDEC standards
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