- RS 제품 번호:
- 489-6041
- 제조사 부품 번호:
- MBH27002-25P/2.6
- 제조업체:
- Malico
22 <재고있음> 5-9영업일내 홍콩 발송
추가완료!
단가 개당
₩11,932.858
| 수량 | 한팩당 |
| 1 - 99 | ₩11,932.858 |
| 100 - 249 | ₩11,456.786 |
| 250 - 499 | ₩10,982.438 |
| 500 + | ₩10,744.402 |
- RS 제품 번호:
- 489-6041
- 제조사 부품 번호:
- MBH27002-25P/2.6
- 제조업체:
- Malico
제정법과 컴플라이언스
- COO (Country of Origin):
- TW
제품 세부 사항
BGA Chipset Heat Sinks
High-performance precision-forged clip-attachment heatsinks for BGA chipsets.
AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
BGA Heatsinks
사양
속성 | 값 |
|---|---|
| For Use With | Clip |
| Length | 27mm |
| Width | 27mm |
| Height | 25mm |
| Dimensions | 27 x 27 x 25mm |
| Mounting | Clip |
| Colour | Black |