HARWIN 3.85 mm Grounding Contact

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Subtotal (1 pack of 10 units)*

₩3,451.50

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10 - 470₩345.15₩3,451.50
480 - 940₩339.30₩3,393.00
950 +₩329.55₩3,295.50

* 참고 가격: 실제 구매가격과 다를 수 있습니다

포장 옵션
RS 제품 번호:
788-4795
제조사 부품 번호:
S1711-46R
제조업체:
HARWIN
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모두 선택

브랜드

HARWIN

Product Type

Grounding Contact

Material

Beryllium Copper Alloy

Fixing Method

Surface Mount

Contact Plating

Tin

Contact Resistance

20mΩ

Height

3.85mm

Standards/Approvals

No

Width

2.28mm

Length

8.79mm

Harwin EZ Boardware SMT RFI Shield Clips


EZ-BoardWare SMT mounting shield clips that provide a fast solution for assembling an RFI shield can to a PCB. These SMT shield clips allow for space saving on the PCB and avoid the need for the RFI shield can to be soldered direct onto the PCB thus reducing PCB assembly costs. The RFI shield can is able to be easily removed for maintenance or repair. These EZ-BoardWare RFI shield clips are suitable for a wide range of shield can thicknesses with various plating options.

Stock number 788-4805 is a Mini RFI shield clip for use with a shield thickness of 0.13-0.23mm and is made from beryllium copper with a tin plating

Stock number 909-4473 is a Mini RFI shield clip for use with a shield thickness of 0.13-0.23mm and is made from stainless steel with a tin plating

Stock number 788-4824 is a Midi RFI shield clip for use with a shield thickness of 0.17-0.3mm and is made from cupro-nickel with a tin plating

Stock number 788-4795 is a Midi RFI shield clip for use with a shield thickness of 0.17-0.3mm and is made from beryllium copper with a tin plating

Stock number 788-4808 is a Maxi RFI shield clip for use with a shield thickness of 0.7-1.0mm and is made from beryllium copper with a tin plating