TE Connectivity 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Closed Frame IC Dip Socket
- RS 제품 번호:
- 719-8817
- 제조사 부품 번호:
- 2-382189-1
- 제조업체:
- TE Connectivity
본 이미지는 참조용이오니 재확인이 필요하시면 문의해주세요.
사용할 수 없음
RS는 더 이상 이 제품을 입고하지 않습니다.
- RS 제품 번호:
- 719-8817
- 제조사 부품 번호:
- 2-382189-1
- 제조업체:
- TE Connectivity
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Number of Contacts | 32 | |
| Mounting Type | Through Hole | |
| Pin Type | Stamped | |
| Pitch | 2.54mm | |
| Row Width | 15.24mm | |
| Frame Type | Closed Frame | |
| Termination Method | Solder | |
| Contact Plating | Tin | |
| Orientation | Vertical | |
| Length | 40.51mm | |
| Width | 5.33mm | |
| Depth | 17.63mm | |
| Dimensions | 40.51 x 5.33 x 17.63mm | |
| Minimum Operating Temperature | -55°C | |
| Housing Material | Thermoplastic | |
| Maximum Operating Temperature | +105°C | |
| Contact Material | Beryllium Copper | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Number of Contacts 32 | ||
Mounting Type Through Hole | ||
Pin Type Stamped | ||
Pitch 2.54mm | ||
Row Width 15.24mm | ||
Frame Type Closed Frame | ||
Termination Method Solder | ||
Contact Plating Tin | ||
Orientation Vertical | ||
Length 40.51mm | ||
Width 5.33mm | ||
Depth 17.63mm | ||
Dimensions 40.51 x 5.33 x 17.63mm | ||
Minimum Operating Temperature -55°C | ||
Housing Material Thermoplastic | ||
Maximum Operating Temperature +105°C | ||
Contact Material Beryllium Copper | ||
- COO (Country of Origin):
- US
TE Connectivity DIPLOMATE Dual Leaf PCB Mount DIP Socket
DIPLOMATE Dual Leaf (DL) DIP sockets with stamped and formed dual wiping contacts for vertical, through hole PCB mounting. These DIPLOMATE Dual Leaf (DL) DIP sockets have black thermoplastic GF stackable housings with a 2.54mm centreline, and a "true closed bottom" design which prevents solder or flux wicking and standoffs to allow board clearance for cleaning after soldering. The profiles for these DIPLOMATE Dual Leaf (DL) DIP sockets are all standard apart from part number 719-8817 which has an over-the-component profile. These DIPLOMATE DIP sockets are available with different frame styles with either straight or retention legs.
For these non-cancellable (NC), and non-returnable (NR) products, Terms and Conditions apply.
관련된 링크들
- ASSMANN WSW 2.54mm Pitch Vertical 14 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A
- ASSMANN WSW 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A
- ASSMANN WSW 2.54mm Pitch Vertical 20 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A
- ASSMANN WSW 2.54mm Pitch Vertical 6 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A
- ASSMANN WSW 2.54mm Pitch Vertical 18 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A
- ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A
- ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A
- ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A
