TE Connectivity 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Closed Frame IC Dip Socket

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포장 옵션
RS 제품 번호:
719-8817
제조사 부품 번호:
2-382189-1
제조업체:
TE Connectivity
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브랜드

TE Connectivity

Number of Contacts

32

Mounting Type

Through Hole

Pin Type

Stamped

Pitch

2.54mm

Row Width

15.24mm

Frame Type

Closed Frame

Termination Method

Solder

Contact Plating

Tin

Orientation

Vertical

Length

40.51mm

Width

5.33mm

Depth

17.63mm

Dimensions

40.51 x 5.33 x 17.63mm

Minimum Operating Temperature

-55°C

Housing Material

Thermoplastic

Maximum Operating Temperature

+105°C

Contact Material

Beryllium Copper

COO (Country of Origin):
US

TE Connectivity DIPLOMATE Dual Leaf PCB Mount DIP Socket


DIPLOMATE Dual Leaf (DL) DIP sockets with stamped and formed dual wiping contacts for vertical, through hole PCB mounting. These DIPLOMATE Dual Leaf (DL) DIP sockets have black thermoplastic GF stackable housings with a 2.54mm centreline, and a "true closed bottom" design which prevents solder or flux wicking and standoffs to allow board clearance for cleaning after soldering. The profiles for these DIPLOMATE Dual Leaf (DL) DIP sockets are all standard apart from part number 719-8817 which has an over-the-component profile. These DIPLOMATE DIP sockets are available with different frame styles with either straight or retention legs.

For these non-cancellable (NC), and non-returnable (NR) products, Terms and Conditions apply.


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