Molex Mini-Latch Series Female Crimp Terminal, 28 AWG Min Crimp, 22 AWG Max

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Subtotal (1 Bag of 100 units)*

₩23,166.00

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Bag(s)
Per Bag
한팩당*
1 - 24₩23,166.00₩232.05
25 +₩23,010.00₩230.10

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
480-7574
제조사 부품 번호:
50802-8100
제조업체:
Molex
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모두 선택

브랜드

Molex

Gender

Female

Product Type

Crimp Terminal

For Use With

2.5 mm Pitch Mini-Latch Wire-to-Wire and Wire-to-Board Receptacle Housing

Series

Mini-Latch

Current

3A

Minimum Wire Size AWG

28AWG

Contact Plating

Tin

Contact Material

Phosphor Bronze

Maximum Wire Size AWG

22AWG

Maximum Contact Resistance

20mΩ

Termination Type

Crimp

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Standards/Approvals

No

COO (Country of Origin):
JP

Molex Crimp Terminal, Female, 28 AWG Minimum Wire size - 50802-8100


This crimp terminal is a high-quality electronic component connector category, designed for efficient wire-to-board and wire-to-wire applications. With a 2.50mm pitch and a crimp termination method, it accommodates a wire size range between 22 to 28 AWG. Constructed from phosphor bronze, the terminal ensures reliable connectivity and durability.

Features & Benefits


• Utilises tin plating for enhanced conductivity

• Constructed from phosphor bronze for improved resilience

• Supports a maximum current of 3.0A per contact

• Durability rated for up to 30 mating cycles

• Termination method allows for secure assembly with tools

Applications


• Used with wire-to-board connections in electronic devices

• Suitable for requiring a compact connector solution

• Used for signal connections in electrical equipment

What tools are recommended for optimal usage with this terminal?


It is advisable to use a hand crimp tool suitable for 2.50mm pitch terminals, specifically designed for 28 to 22 AWG wires. An extraction and activation tool may also be beneficial for the installation process.

How does the tin plating contribute to the terminal's performance?


Tin plating provides excellent corrosion resistance and improves the electrical conductivity of the connections, ensuring consistent signal integrity over time.