Molex, 76530 1.9 mm Pitch PCB Backplane Connector, Vertical, 10 Column, 15 Row, 150 Way

대량 구매 할인 기용 가능

Subtotal (1 tray of 10 units)*

₩409,480.50

Add to Basket
수량 선택 또는 입력
제조사가 재고 비축중
  • 2026년 6월 22일 부터 배송 준비 완료
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.

수량
한팩당
Per Tray*
10 - 40₩40,948.05₩409,484.40
50 +₩40,129.05₩401,286.60

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
691-833
제조사 부품 번호:
76530-1030
제조업체:
Molex
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Molex

Backplane Connector Type

PCB

Product Type

Backplane Connector

Number of Contacts

150

Current

0.75A

Orientation

Vertical

Number of Columns

10

Number of Rows

15

Voltage

30V

Housing Material

High Temperature Thermoplastic

Pitch

1.9mm

Mount Type

Through Hole

Contact Material

High Performance Alloy

Contact Plating

Gold over Tin

Termination Type

Pin

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

85°C

Contact Gender

Male

Standards/Approvals

UL E29179

Series

76530

COO (Country of Origin):
SG
The Molex Impact 100 Ohm 5 Pair Mezzanine Receptacle is designed to provide reliable connectivity for high-speed data transfer applications. This product features a 38mm stack height and unguided design, ensuring a secure fit in Compact environments. With 10 columns and 150 circuits, the receptacle allows for efficient space utilisation while maintaining excellent electrical performance, supporting data rates up to 25.0 Gbps. The product’s solder process capability is lead-free, aligning it with contemporary environmental standards, thus appealing to sustainability-conscious manufacturers. Ideal for backplane connectors in mezzanine applications, this receptacle offers an efficient combination of durability and performance to meet demanding technical requirements.

Supports a maximum current of 0.75A per contact for robust performance

Designed for a data rate of 25.0 Gbps, ensuring high-speed data transmission

Impedance of 100Ω, optimising signal integrity for reliable connections

Constructed with high-performance alloy for enhanced durability

Vertical orientation allows for efficient space management in various applications

Endures up to 200 mating cycles, ensuring long-lasting usability

Compatible with a range of PCB thickness options, promoting flexibility in design

관련된 링크들