Potting Compounds

Potting compounds are a general-purpose types of sealant that can offer environmental, mechanical and physical protection to circuit boards and electronic assemblies. Used in electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound. The potting compound, once applied, cured and hardened encases your electronics in a solid mass providing a barrier which provides protection from moisture, vibration, thermal or physical shock and general contamination. The mechanical protection enables the components to maintain high performance under extreme conditions. Thermosetting plastics or silicone rubber gels are often used.

Types of compounds

Epoxy Potting Compounds - Epoxy potting compounds generally perform as a better adhesive, high temperature resistance, and chemical resistance. Epoxy systems have better adhesion to a wide variety of substrates and typically do not need primers. They are easy to use and are predictable. They have good high temperature resistance up to 400°F.

Urethane Potting Compounds - Urethane potting compounds generally have better flexibility, elongation, and abrasion resistance. Since they can have Tg below -40°C they are an excellent selection for SMT PC board potting. Their gel time can be easily changed with an accelerator without changing the properties.

Silicone Potting Compounds - Silicone potting compounds and encapsulating materials are also soft, flexible, and have better elongation. Silicone materials also provide the widest operating temperatures. Specially formulated silicone potting compounds can operate at below -100°C and most silicone materials can handle 200°C temperatures.

Acrylic Potting Compounds - Acrylic potting compounds are UV and heat hardening materials. They benefit from very fast hardening, adequate chemical resistance and are clear in appearance.

Applications of Potting Compounds

Potting compounds are used in a range of applications such as;

  • Military
  • Industrial
  • Automotive industry
  • PCB's
  • Coils

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제품설명 단가 Trade Name Product Material Package Type Package Size Special Properties Cure Time Hardness Thermal Conductivity Colour Maximum Operating Temperature Minimum Operating Temperature Chemical Composition Dielectric Strength Odour
RS 제품 번호 725-9997
제조사 부품 번호ER2218RP250G
제조사Electrolube
₩27,754.30
Each
수량
ER2218 Epoxy Pack 250 g Flame Retardant 24 h 55 Shore D, 90 Shore A 0.28W/mK Black +150°C -50°C - - -
RS 제품 번호 166-844
제조사 부품 번호UR5097RP250G
제조사Electrolube
₩29,022.20
Each
수량
UR5097 PUR Pack 250 g Encapsulating Compound, Flame Retardant, Thermal Conductivity 24 h 85 Shore A 0.65W/mK Black +110°C -40°C - - -
RS 제품 번호 164-292
제조사 부품 번호UR5044RP250G
제조사Electrolube
₩27,726.40
Each
수량
UR5044 PUR Pack 250 g Reenterable 24 h 40 Shore A, 60 Shore A, 80 Shore A 0.25W/mK Blue +120°C -70°C - - -
RS 제품 번호 164-315
제조사 부품 번호ER2195RP250G
제조사Electrolube
₩23,133.75
Each
수량
ER2195 Epoxy Pack 250 g Flame Retardant 36 h 80 Shore D 0.45W/mK Black +130°C -40°C - - -
RS 제품 번호 164-321
제조사 부품 번호ER1450RP250G
제조사Electrolube
₩32,391.90
Each
수량
ER1450 Epoxy Pack 250 g Water Resistance 2 h 70 Shore A - White +150°C -50°C - - -
RS 제품 번호 458-800
제조사 부품 번호UR5083RP250G
제조사Electrolube
₩45,311.15
Each
수량
UR5083 PUR Pack 250 g Water Resistance 48 → 72 h - - Translucent +100°C -60°C - - -
RS 제품 번호 164-337
제조사 부품 번호ER1448RP250G
제조사Electrolube
₩27,772.90
Each
수량
ER1448 Epoxy Pack 250 g Water Resistance 12 h 70 Shore A - Black +150°C -50°C - - -