TE Connectivity IFP/LEC Assembly for use with Intel® Xeon® Phi™ Processor 7200F

Cables provide 4x and 8x high speed data transmission lanes
Straight and right-angle (left/right exit) Linear Edge Connector (LEC) cable plugs to accommodate cable routing
Bail latch with pull tab on LEC plug and spring latching on IFP plug provides secure connections
Mid-board copper chip-to-I/O interconnect reduces host system board trace lengths and PCB cost
Assemblies utilize TE bulk cable 30 AWG 85 Ohms TurboTwin 25 Gbps primary pair cable
Applications
Data Center & Networking Equipment
Servers
Routers
High Performance Computing (HPC)