- RS 제품 번호:
- 182-2279
- 제조사 부품 번호:
- 74221-101LF
- 제조업체:
- Amphenol Communications Solutions
일시 품절-다음 입고 날짜는 04/10/2024 (일/월/년) 이며, 그 후 5-10영업일내 홍콩에서 발송. 정확한 입고 수량에 대한 문의는 krenquiry@rs-components.com 로 연락주세요.
추가완료!
단가 개당가격(250개가 1릴안에)
₩35,632.984
수량 | 한팩당 | Per Reel* |
250 - 250 | ₩35,632.984 | ₩8,908,461.663 |
500 - 750 | ₩34,920.601 | ₩8,730,279.493 |
1000 + | ₩34,222.016 | ₩8,555,676.49 |
*다른 단위에 대한 가격 표시 |
- RS 제품 번호:
- 182-2279
- 제조사 부품 번호:
- 74221-101LF
- 제조업체:
- Amphenol Communications Solutions
제정법과 컴플라이언스
- COO (Country of Origin):
- US
제품 세부 사항
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.
사양
속성 | 값 |
---|---|
Package Type | BGA |
IC Socket Type | Prototyping Socket |
Gender | Female |
Number of Contacts | 400 |
Contact Material | Copper Alloy |
Contact Plating | Gold |
Current Rating | 450.0mA |
Socket Mounting Type | Surface Mount |
Device Mounting Type | Surface Mount |
Voltage Rating | 200.0 V |
Termination Method | Through Hole |
Housing Material | Liquid Crystal Polymer |