Bergquist Heatsink Adhesive Tape for use with Heatsink
- RS 제품 번호:
- 477-4856
- 제조사 부품 번호:
- BP100-0.005-00-00-12
- 제조업체:
- Bergquist
57 <재고있음> 5-9영업일내 홍콩 발송
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단가 개당
₩27,315.516
| 수량 | 한팩당 |
| 1 - 99 | ₩27,315.516 |
| 100 - 249 | ₩26,223.655 |
| 250 + | ₩25,128.343 |
- RS 제품 번호:
- 477-4856
- 제조사 부품 번호:
- BP100-0.005-00-00-12
- 제조업체:
- Bergquist
제정법과 컴플라이언스
- COO (Country of Origin):
- US
제품 세부 사항
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
Note
Stock Number 477-4856 dimensions 150 x 150 x 0.127 mm
Stock Number 477-4862 dimensions 50 x 50 x 0.127 mm
Stock Number 4774878 dimenssions 250x 25 x 0.127 mm
Stock Number 477-4862 dimensions 50 x 50 x 0.127 mm
Stock Number 4774878 dimenssions 250x 25 x 0.127 mm
사양
속성 | 값 |
|---|---|
| Accessory Type | Adhesive Tape |
| For Use With | Heatsink |