Bopla BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm
- RS 제품 번호:
- 200-5494
- 제조사 부품 번호:
- 35310100 BOP 10.1 S
- 제조업체:
- Bopla
2 <재고있음> 5-9영업일내 홍콩 발송
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단가 개당
₩39,948.684
| 수량 | 한팩당 |
| 1 - 9 | ₩39,948.684 |
| 10 - 24 | ₩38,344.527 |
| 25 + | ₩37,551.073 |
- RS 제품 번호:
- 200-5494
- 제조사 부품 번호:
- 35310100 BOP 10.1 S
- 제조업체:
- Bopla
참조 문서
제정법과 컴플라이언스
제품 세부 사항
The Bopla BoLink IoT Enclosure is a sensor enclosure which is made of polycarbonate material. It is a very intelligent and versatile enclosure system for modern IoT sensor technology. The enclosure is available in three variants without wall brackets, with wall brackets, with wall brackets and lid fixing on top. The PC material is suitable for outdoor use due to f1-listing according to UL 746C.
IP65 rating
UL 94 V0 Fire class
Design seal optional
UL 94 V0 Fire class
Design seal optional
사양
속성 | 값 |
|---|---|
| Type | Seal |
| Length | 291mm |
| For Use With | BoPad 10.1 Enclosures |
| Width | 204mm |
| Dimensions | 291 x 204 x 54.3mm |
| Height | 54mm |
| Series | BoLink |