50Ω STMicroelectronics Surface Mount Chip Balun

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Baluns use ST’s process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function. ST's latest balun-the 1.2 mm² footprint BALF-NRG-02D3-is customized for our BlueNRG-1 and new BlueNRG-2 transceivers, reducing RF complexity and providing optimized link budget

The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance

2.4 – 2.5 GHz balun with integrated matching network
Matching optimized for following chipsets: ATSAMR21E18
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated CSP on glass bumpless
Small footprint 2.5 mm²

사양
속성
Unbalance Impedance 50Ω
Balance Impedance 50Ω
Maximum Insertion Loss 1.3dB
Mounting Type Surface Mount
Pin Count 6
Dimensions 2.1 x 1.35 x 0.455mm
Height 0.455mm
Length 2.1mm
Width 1.35mm
Maximum Frequency 2.5GHz
Minimum Frequency 2400MHz
Maximum Operating Temperature +105°C
Minimum Operating Temperature -40°C
일시 품절-다음 입고 날짜는 15/09/2020 (일/월/년) 이며, 그 후 5-10영업일내 홍콩에서 발송. 정확한 입고 수량에 대한 문의는 krenquiry@rs-components.com 로 연락주세요.
단가 Each (In a Pack of 50)
480.50
(exc. VAT)
수량
한(1)개당
한(1)팩당*
50 - 50
₩480.50
₩24,025.00
100 - 950
₩361.15
₩18,065.25
1000 +
₩285.20
₩14,291.00
*다른 단위에 대한 가격 표시
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