Thermal Adhesives

Thermal adhesives are a type of adhesive commonly used to attach a heatsink to electronic components. The glue is typically a two part epoxy resin which cures to form a strong bond. They are thermally conductive and usually electrically insulating, helping to dissipate heat from the device to prevent overheating or a breakdown.

The main function of a thermal adhesive is to ensure there is no air space between which would act as a thermal insulator. It fills in the microscopic imperfections on the heatsink and device.

There are a variety of thermal compound adhesives available that are ideal for eliminating the air gap under a heat sink. The most common types of thermally conductive adhesives are:

  • Thermal paste
  • Thermal glue
  • Thermal adhesive tape
  • Thermal Grease
  • Thermal Gap Pads


Thermal adhesives are used in a variety of industries and applications such as:

  • Heat sink bonding
  • Potting/encapsulating sensors
  • BGA die heat spreader interface
  • Chip scale packages
  • Power semiconductors

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총 2개 제품 중 1번째-2번째 제품을 조회 중
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제품설명 단가 Trade Name Type Product Material Package Type Package Size Thermal Conductivity Cure Time Maximum Operating Temperature Minimum Operating Temperature Chemical Composition Dielectric Strength Odour Operating Temperature Range Physical Form
RS 제품 번호 503-357
- Thermal Conductive Compound Non-Silicone Syringe 35 ml 0.65W/mK - +130°C -40°C Zinc Oxide 40kV/mm No Characteristic -40 → +130 °C Paste
RS 제품 번호 725-9993
1 Kit
- Thermal Conductive Adhesive Acrylic Syringe 20 ml 0.82W/mK 5 → 10 min +150°C -50°C Heptane, Methylcyclohexane, Propan-1-ol, Pyridine - Hydrocarbons -50 → +150 °C Liquid